- Bonding speed:
- Bonding accuracy:
- BPO:
- Lead frame width:
- 42ms/wire
- ±2μm
- ≥50μm
- customized
Wire Bonder ROCKET HT
Wire Bonder ROCKET HT is a high-speed automatic wire bonder developed by Guangdong Guangdong ADA Semiconductor Equipment Ltd. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.
Suitable material
Used for rare copper lead frame packaging, TO252，TO263，TO220，SOT23 etc.
Performance feature
1.Speed: 42ms/wire(2mm length)
2.Stability: MTBA>2hrs
3.Accuracy: ±2μm, handle BPO≥50μm product
4.Fine bond force control for thin or fragile material
5.Dual frequency transducer(optional), dual path optics(optional)
6.Constant temperature BH + PBI + SAA for system accuracy
7.Seal material handling system, with inert gas circle for lead frame anti-oxidation, the handler system can support application upto 280degC.