- Bonding Speed
- Bonding Accuracy:
- Maximum lead frame width:
- 40ms/wire
- ±2μm
- 83mm
Wire Bonder ROCKET IC
Wire Bonder ROCKET IC is a high-speed automatic wire bonder developed by Guangdong Guangdong ADA Semiconductor Equipment Ltd. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.
Material
Used for IC packaging, SOP、SOT、QFP、 DFN、 DIP、QFN、 BGA etc.
Performance
1.Handle BPO>40μm product.
2.Stability： MTBA>2hrs.
3.Fine bond force control for thin or fragile material.
4.Dual frequency transducer(optional), dual path optics(optional).
5.Constant temperature BH + PBI + SAA for system accuracy.