- Bonding Speed:
- Bonding Accuracy:
- Maximum lead frame width:
- 38ms/wire
- ±2μm
- 83mm
Wire Bonder ROCKET PLUS
Wire Bonder ROCKET PLUS is a high-speed automatic wire bonder developed by Guangdong Guangdong ADA Semiconductor Equipment Ltd. It uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.
Suitable material
Suitable for all kinds of materials：2835，5050，2121RGB，1515RGB，1010RGB，020，Filament，etc.
Performance feature
1.Dual frequency transducer, stable ultrasonic power, constant ball shape, tail, ball shear &wire pull
2. Piezo-wire clamp, fast response and consistent looping
3. Hot/cold air for bond head temperature control to ensure system thermal stability, suitable for 35μm BPO and above
4.Magazine and track auto adjust function, fast lead frame switching (optional)
5.Lead frame reverse loading auto detection
6.Compatible with SECS/GEM, https link
7.Capillary consumption auto compensation and capillary cleaning function, to improve capillary life time